Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards
  • Air ProCompetitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards

Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards

The following is about Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards related, I hope to help you better understand Mutilayer PCB.

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Product Description

Competitive Price High TG FR4 HDI FR4 Multilayer PCB Printed Circuit Boards

 

Deliverables
1/Quotes in 24 hours or less   
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Sunshine has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance
Products infomation
8 layer,
Material:FR4(Tg180) material,
PCB thickness:1.60mm thick,
Final copper:1 OZ finished copper on all layers,
Surface:ENIG surface finish,
Ttchnology:with hard gold finger at edge-board,
Solder mask:green solder mask, 
with impedance control
6.0/7.0mil min w/s(line width/spacing),
min drill bit:0.20mm,
min BGA pad size:0.33mm

if build the board. please send us Gerber file and bom list violet at akesoncircuit.com.cn

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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