Dupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb
  • Air ProDupont material PCB 8layer Rigid-flex board with fast pcb

Dupont material PCB 8layer Rigid-flex board with fast pcb

The following is about dupont material PCB 8layer Rigid-flex board with fast pcb related, I hope to help you better understand Rigid-Flex Boards.

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Product Description

Dupont material PCB 8layer Rigid-flex board with fast pcb

 

if have Gerber file or enquire. please email is violet(at)akesoncircuit(dot)com(dot) cn

Deliverables
1/Quotes in 24 hours or less 
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Akeson has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance

 

Rigid-flexible pcb capacity

 

Technical  Specification
Materials
Polyimide/Polyester
Remark&Test Method
Number of Layer
FPCB 1-8/Rigid-flex:3-6
 
Min.Trace
Width/Space
Single Side
0.050mm(2mil)
 
Double Side
0.050mm(2mil)
 
Min.Hole
Diameter
Drilling(P.T.H.)
φ0.15mm
 
Punching
φ0.50mm
Dimension
Tolerance
Conductor Width
20%
W≤0.5mm
Hole Diameter(H)
0.05mm
H≤1.5mm
Accumulated
Pitch
0.05mm
P≤25mm
Outline Dimension
±0.1mm
L≤50mm
Conductors And
Outline
±0.07mm
C≤5.0mm
Surface Treatment On Terminal
And Land Area
Au(0.03-1.5um)
 
Ni(1-6um)
Sn(7-20um)
Peeling Strength(180° Direction)
1.0kg f/cm
IPC-TM-650 2,4,9
Solder Heat Resistance
260/10 secs
 

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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