High-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA
  • Air ProHigh-density Multilayer PCBA

High-density Multilayer PCBA

The following is about High-density Multilayer PCBA related, I hope to help you better understand High-density Multilayer PCBA.

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Product Description

High-density Multilayer PCBA

 

if have PCB copy. please send us sample to violet (at) akesoncircuit (doc) com (dot) cn

Mobile Phone Antenna Charger Copy Board

Analyse details,

printed circuit board parameters:

PCB Size: 75x75.5X2.5mm

double side layer.

 material:1OZ  FR-4

 components quantity 50 +

Copy Board period: 1 Day

Copy Board File: Circuit Schematic Diagram, PCB file, Bom  Special Material List

 business: Copy Board sample PCB. With the production of sample surface and testing, batch PCBA processing

PCB Ccopy prduction:

1. Wireless Communication Equipment: such as Wireless Base Station;

2.  Optical network transmission equipment: such as SDH, DWDM equipment. 3. Data communication equipment: such as high-end Router, Lanswitch, ADSL, etc. .

4.High-end computing equipment: servers, motherboards and so on.

 5. Multimedia Electronic Equipment: TV, HDTV, DVD, DVB, LCD TV, PDP, LCOS, DLP.

 6. High-power switching power supply products: home appliances, computers, communications, switching power supply PCB design.

7. Power Electronic Equipment: FREQUENCY CONVERTER, UPS, industrial power supply, Industrial Control Board. Various Industrial Control PCB design.

8. Industrial Control Equipment, automotive control system, medical electronic equipment.


Reference - Our Production Capability for Multilayer PCB/Rigid borad

 

Item

 

M-

Layer count

1-30 layers

Material

FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.

Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui

Maxpanel size

32±20(800mm±508mm)

Min width/space(min)

4mil/4mil

Max copper weight

140um(4oz) for inner layer

175um(5oz) for outer layer

Min machine drill size

0.2mm(8mil)

Via hole tpye

Blind/Burried/plugged

Thickness of finished board

0.20-6.0mm

Tolerance

Registration of innerlayer to of innerlayer:±3mil

Accuracy  of  hole position:±2mil

Tolerance of dilled slot:±3mil

Tolerance of PTH diameter:±3mil

Tolerance of NPTH diameter:±2mil

PTH  hole copper thichness: 0.4-2mil

Image to image tolerance:±3mil

Tolerance of etching:±1mil

Solder mask registration tolerance: ±2mil

Finished board : Thickness<=1.0mm: +/-0.1mm

             Thickness>0.1mm:+/-10%

Outline router: +/-0.1mm

Outline Score: +/-0.2mm

Color of solder mask

Green, Black, Blue,Red, White and so on

Surface freatment

HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask

Hardness of solder solder

>=6H

Outline finished

CNC, V-CUT, Punching

Peel strength of line

≥61B/in

Warp and twist

≤0.7%

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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