ISO901 electronic low volume 4 layer PCBA / PCB electronic manufacturing assembly services
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ISO901 electronic low volume 4 layer PCBA / PCB electronic manufacturing assembly services

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Product Description

 ISO901 electronic low volume 4 layer PCBA / PCB electronic manufacturing assembly services


PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips: 01005, BGA, QFP, QFN and TSOP
• Component height: 0.2-25mm
• Minimum Packing: 0201
• Minimum distance among BGA: 0.25-2.0mm
• Minimum BGA size: 0.1-0.63mm
• Minimum QFP space: 0.35mm
• Minimum assembly size: (X) 50 * (Y) 30mm
• Maximum assembly size: (X) 350 * (Y) 550mm
• Pick-placement precision: ±0.01mm
• Placement capability: 0805, 0603, 0402 and 0201
• High pin count press fit available
• SMT capacity per day: 800,000 point
 
DIP capability:
• A-8 of semi-assembly work line with 3 set wave soldering machines
• B-4 of high/low-temperature burn-in test ovens for the burn-in tested required products
• All products are 100% inspected and tested during the DIP process

 

if have Gerber file and bom list. plesae send us violet at akesoncircuit.com.cn

 

we will quote soon

 

 

Item

 

M-

Layer count

1-30 layers

Material

FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.

Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui

Maxpanel size

32±20(800mm±508mm)

Min width/space(min)

4mil/4mil

Max copper weight

140um(4oz) for inner layer

175um(5oz) for outer layer

Min machine drill size

0.2mm(8mil)

Via hole tpye

Blind/Burried/plugged

Thickness of finished board

0.20-6.0mm

Tolerance

Registration of innerlayer to of innerlayer:±3mil

Accuracy  of  hole position:±2mil

Tolerance of dilled slot:±3mil

Tolerance of PTH diameter:±3mil

Tolerance of NPTH diameter:±2mil

PTH  hole copper thichness: 0.4-2mil

Image to image tolerance:±3mil

Tolerance of etching:±1mil

Solder mask registration tolerance: ±2mil

Finished board : Thickness<=1.0mm: +/-0.1mm

             Thickness>0.1mm:+/-10%

Outline router: +/-0.1mm

Outline Score: +/-0.2mm

Color of solder mask

Green, Black, Blue,Red, White and so on

Surface freatment

HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask

Hardness of solder solder

>=6H

Outline finished

CNC, V-CUT, Punching

Peel strength of line

≥61B/in

Warp and twist

≤0.7%


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