Multilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density
  • Air ProMultilayer pcb 100% tested working computer pcb Motherboard with BGA High density

Multilayer pcb 100% tested working computer pcb Motherboard with BGA High density

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Product Description

Multilayer pcb 100% tested working computer pcb Motherboard with BGA High density


if have Gerber file or enquire. please email is violet(at)akesoncircuit(dot)com(dot)cn

Deliverables
1/Quotes in 24 hours or less 
2/Standard production leadtime of 20 working days (4 weeks)
3/Prototype leadtime of 5 to 10 working days (1-2 weeks)
4/Stack-ups and impedance simulation in 36 hours
5/Initial response to technical questions or quality concerns in 36 hours
6/DFM and EQ's prior to PO placement upon request
Quality system
1/Akeson has mature and stringent Q
2/100% AOI, 100% ET, 100% FQC + FQA
3/SPC and Cpk programs
4/Lean Manufacturing and 6S programs
5/Advanced inspection and lab equipment
6/Standard QA report with every shipment
7/RoHS and REACH Compliance
8/Conflict Minerals Compliance

 

Detailed Product Description

Multilayer pcb

 

1) Layer:10

2) Board finished thickness: 1.6mm

3) Material: FR-4

4) Min. drilled hole size: 0.3mm

5) Min. Line width:  0.1mm

6) Min.Line spacing: 0.1mm

7) Surface finish/treatment :HASL

8) Copper thickness: 1 OZ

10) Solder mask color: blue

11) Copper thickness in hole: >25.0 um  (>1mil)

12)Inner packing: Vacuum packing / Plastic bag

    Outer packing: Standard carton packing

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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