OEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly
  • Air ProOEM Fr4 PCB Board Assembly

OEM Fr4 PCB Board Assembly

The following is about OEM Fr4 PCB Board Assembly related, I hope to help you better understand OEM Fr4 PCB Board Assembly.

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Product Description

OEM Fr4 PCB Board Assembly

AKESON PCB Bare Board:
Multi-layer,FR4,Metal,Creamic,Rogers,FPC,HDI board.
HASL,Immersion Gold/silver/Au,OSP, etc.

PCB Assembly:
9 Testing Procedures,100% Functional Tested.
BGA with X-Ray and Lead Free Assembly.

Components Sourcing:
15 Years Purchasing Experience.
Multi-channel Component Supply.

Finished products assembly:
Functional test/Programing. 
Conformal Coating. Burning test.
Gift Box Packing. Storege Service.


Our advantages:
1, Online 360° Panoramic View Factory.
2, National High-tech Enterprise.
3, ISO9001, ISO13485, IATF16949 Certification.
4, Customade ERP To Control The Process.
5, No MOQ, Flexible Service.
Contact us to get quotation.


Item

 

M-

Layer count

1-30 layers

Material

FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.

Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui

Maxpanel size

32±20(800mm±508mm)

Min width/space(min)

4mil/4mil

Max copper weight

140um(4oz) for inner layer

175um(5oz) for outer layer

Min machine drill size

0.2mm(8mil)

Via hole tpye

Blind/Burried/plugged

Thickness of finished board

0.20-6.0mm

Tolerance

Registration of innerlayer to of innerlayer:±3mil

Accuracy  of  hole position:±2mil

Tolerance of dilled slot:±3mil

Tolerance of PTH diameter:±3mil

Tolerance of NPTH diameter:±2mil

PTH  hole copper thichness: 0.4-2mil

Image to image tolerance:±3mil

Tolerance of etching:±1mil

Solder mask registration tolerance: ±2mil

Finished board : Thickness<=1.0mm: +/-0.1mm

             Thickness>0.1mm:+/-10%

Outline router: +/-0.1mm

Outline Score: +/-0.2mm

Color of solder mask

Green, Black, Blue,Red, White and so on

Surface freatment

HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask

Hardness of solder solder

>=6H

Outline finished

CNC, V-CUT, Punching

Peel strength of line

≥61B/in

Warp and twist

≤0.7%

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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