PCB for LED Aluminum Heights Round Lamp Ring Lamp
  • Air ProPCB for LED Aluminum Heights Round Lamp Ring Lamp
  • Air ProPCB for LED Aluminum Heights Round Lamp Ring Lamp
  • Air ProPCB for LED Aluminum Heights Round Lamp Ring Lamp
  • Air ProPCB for LED Aluminum Heights Round Lamp Ring Lamp

PCB for LED Aluminum Heights Round Lamp Ring Lamp

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Product Description

PCB for LED Aluminum Heights Round Lamp Ring Lamp

LED Circuit Board/MCPCB/Aluminum Based PCB

 
1. Aluminium base material, 
2. 1oz copper, Board thickness 1.2mm 
3. Excellent quality with competitive price 

1. 1 Layer Aluminium base material pcb board 
2. 1oz copper, Board Thickness 1.2mm
3. Excellent quality with competitive price

4. Application for led bulb lamp

5. Certificate: ROHS, UL, ISO9001-2000, ISO14001

6. led pcb assembly for led lighting.


 Our  Manufacturing Capability for PCB Board

 

items

technical index

Product model

al substrate   cu substrate

material thermal conductivity

1.0/m.k, 1.5/m.k, 2.0/m.k, 3.0/m.k

     thermal impedance

0.85 °C/W – 0.4 °C/W

     al base material type

1060 / 5050 / 5052

surface disposal

HASL/ OSP/ immersion gold/ immersion tin/ immersion silver

           layer

Single-side al substrate / double-side al substrate /four-layer al substrte

   maximum measurement

1200mm*460mm

   minimum measurement

5mm*5mm

line width/space

0.1mm

warp and twist

≤0.5%(thickness:1.6mm, measurement:300mm×300mm)

processing thickness

0.3-5.0mm

copper foil thickness

35um  70um  105um  140um

molding dimension tolerance

±0.15mm

v-cut positioning accuracy

±0.1mm

aperture location deviation

±0.076mm

scope of molding dimension tolerance

cnc:±0.1mm   punching:±0.15mm

breakdown voltage

3KV - 5KV

peel strength

≥1.4N/mm

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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