Rogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer
  • Air ProRogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer

Rogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer

The following is about Rogers pcb Supplier High Frequency Pcb Manufacturer High Quality Multilayer Printed Circuit Board Manufacturer related, I hope to help you better understand HDI PCB.

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Product Description



Akeson Circuit Factory 14Years Experience and more than 1000 Staffs

 
8-layer PCB, 10-layer and 12-layer
Base material: FR-4
Thickness: 1.6mm
Finishing: 6-ounce copper, immersion tin/gold and outlined byCNC routing
Solder mask: LPI (green)
Minimum line width/spacing: 0.1mm

Mutilayers PCB HDI Circuit Board

 

1. ONE-STOP-SERVICE

 2. OEM service

 3. Gerber file needed

 4. PCB clone with sample

 5. Quality guarantee and professional after-sell service

Multiple layer: 1 to 30 layers high-density various material PCBs
Material: FR-4, 0.5 to 3oz copper, 0.15 to 3.2mm thickness
Minimum line width and line spacing: 4mm
Minimum hole diameter: 0.2mm
Maximum panel size: 800 x 508mm
Surface finish:
HAL alpha level, gold plating, ENTECH
HAL or tin and gold plating
Solder mask type: photo liquid
Precision V-cut for panel form design
OEM orders for SMT and A/I assembly projects accepted
Gerber file preferred

 
Reference - Our Production Capability for Multilayer PCB/Rigid borad
Item
Multilayers PCB High Density Circuit Board
Layer count
1-30 layers
Material
FR4(High TG, Halogen Free, high frequency), CEM1, CEM3,BT,Al base mateiral,and so on.
Supplier: SY,KB,ITEQ,Isola,Nelco,Rogers,Grance,Mitsui
Maxpanel size
32±20(800mm±508mm)
Min width/space(min)
4mil/4mil
Max copper weight
140um(4oz) for inner layer
175um(5oz) for outer layer
Min machine drill size
0.2mm(8mil)
Via hole tpye
Blind/Burried/plugged
Thickness of finished board
0.20-6.0mm
Tolerance
Registration of innerlayer to of innerlayer:±3mil
Accuracy of hole position:±2mil
Tolerance of dilled slot:±3mil
Tolerance of PTH diameter:±3mil
Tolerance of NPTH diameter:±2mil
PTH hole copper thichness: 0.4-2mil
Image to image tolerance:±3mil
Tolerance of etching:±1mil
Solder mask registration tolerance: ±2mil
Finished board : Thickness<=1.0mm: +/-0.1mm
Thickness>0.1mm:+/-10%
Outline router: +/-0.1mm
Outline Score: +/-0.2mm
Color of solder mask
Green, Black, Blue,Red, White and so on
Surface freatment
HASL,HASL Lead Free,OSP ,Immersion Gold, Immersion Ti, Immersion Sliver, Flash gold, Selective Gold plating(gold thicness up to 120u),Gold figers ,Carbon print, Peelabe Mask
Hardness of solder solder
>=6H
Outline finished
CNC, V-CUT, Punching
Peel strength of line
≥61B/in
Warp and twist
≤0.7%

 


Quickly
Sample(Normal)
Mass(Normal)
Single-sided:
1-2 days
3-5 days
7-8 days
Double-sided:
2-3 days
5-8 days
8-10 days
4 Layers:
3-4 days
8-10 days
10-12 days
6 Layers:
5-6 days
10-12 days
12-14 days
8 Layers:
6-8 days
10-12 days
14-16 days
10 Layers:
8-10 days
12-14 days
16-18 days
12 Layers:
10 days
14-16 days
16-18 days
>14 Layers:
>=10 days
>=16 days
>=16 days
Note:Specially Board Regards document specific request


U.S.UL product ceftification,PCB E354170 PCB;
ISO 90012008
ISO/TS 16949
QuaIity assurance standards lPC-A-600 HlPC-6011l PC-6012 BlPC-D-300 ANSl-UL-796
AnaIysis CapabiIity
In-House(Lab)
Follow the lPC-TM-650 for test function Follow the lPC-TM-650 for test function
PeeIable strength test for copper foil
Metal thickness
Flash Gold sliding pad roughness test
Solder Mask Gloss Level test
Cross section
SoIderability & Thermal shock test
Lead-free reflow simulation test(up to 280C)
Additional test can be tested at GF
authorized lab

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PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba

PCB Copying/pcb design ,HDI PCB,High-density multilayer PCBA,FR4 PCB,pcb board,Mobile phone wireless charger pcba



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